By John G. Webster (Editor)

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Costs for these advanced units in production volumes are projected to be comparable to current technology (7,13,14,19). Projected energy densities for advanced storage capacitors are illustrated in Fig. 1. Projected power densities for high frequency acϩdc filter capacitors are shown in Fig. 2. , such as power density) (2,3,7,19). If evolution were allowed to drive capacitor technology, meeting these requirements would take 80 to 90 years. Therefore, R&D underway now will move toward these requirement-driven performance levels within the next decade (7,8).

Figure 5 shows a cross section of the capacitor section that highlights similarities to conventional metallized film and MLC constructions. The dielectric systems in current use are polyethylene terephthalate (PET), polyethyl- ene napthalate (PEN) and polyphenylene sulfide (PPS). The dielectric selected is based on the specific environmental and electrical properties required. PET and PEN are voltage-stable materials that compete favorably with X7R ceramic capacitor types. PPS is a very low loss and temperature-stable dielectric which offers size reduction compared to zero temperature coefficient ceramic chips.

Their application was for filtering, both input and output, of SMPS circuitry, never a standard application of tantalum capacitors. CAPACITOR INSULATION 29 Silver ;;;;;;;;; Carbon Interconnected tantalum particles Ta2O5 dielectric layer MnO2 penetration into channels Their performance in this application may be decades worse than ceramics but they are readily surface mountable and they cost much less. They can easily withstand the surges and the constant ripple currents. Again, manufacturing moves in a direction opposite to the traditional tantalum chip development philosophy.

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17.Dielectrics and Electrical Insulation by John G. Webster (Editor)


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